The 0.8×3.0 Double Slot female connector is a compact, high-density board-to-board socket designed for next-generation electronic systems that require stable interconnections in extremely limited PCB spaces. With its fine 0.8mm pitch and dual-slot female design, this connector supports multiple signal and power lines while keeping the device footprint minimal—making it ideal for modern IoT devices, wearables, portable medical equipment, embedded systems, and industrial automation modules.
Constructed using high-temperature insulating plastics and gold-plated contacts, it provides low Contact Resistance, superior Signal Integrity, and long-term durability. The side-in slide/push mating structure ensures secure installation, reduces assembly errors, and improves production efficiency—perfect for mass manufacturing and high-reliability electronics.
High-Density Double Slot Design (Max Pin Count in Minimal Space)
Two contact rows maximize connection points without increasing the PCB footprint, ideal for high-density board-to-board applications.
0.8mm Pitch for Compact PCB Layouts
Supports advanced miniaturized electronics, including IoT sensors, embedded system modules, and portable medical devices.
Superior Electrical Performance
Gold-plated terminals provide:
Low resistance
Stable high-frequency signal transmission
High-speed data integrity
Strong corrosion resistance
Durable & Protective Housing
Robust insulating plastic shields contacts from dust, vibration, humidity, and mechanical stress—ideal for industrial or harsh environments.
Fast, Reliable Assembly
Push-in/slide-in side entry simplifies production and mAIntenance, ensuring secure mating and reducing installation errors.
Suitable for Mixed Power & Signal Lines
Designed to handle both data and power transmission, supporting complex PCB architectures.
The 0.8mm Double Slot Female Connector is widely used in space-constrained and performance-critical devices:
Wearables, tablets, handheld devices, portable medical instruments, smart home modules.
Edge computing units, intelligent gateways, wireless communication modules, compact sensors.
Control boards, robotic sensors, compact PLC modules, rugged industrial electronics.
Diagnostic devices, network modules, portable monitoring systems, high-speed communication boards.
Environments exposed to vibration, temperature cycling, or dust—thanks to its dual-slot stability and environmental resistance.
A: Pin count varies by model. It features dual rows with a 0.8mm pitch, supporting multiple connection points for power and data.
A: Yes. With gold-plated terminals, it ensures stable high-speed signal transmission with minimal signal degradation.
A: It is engineered for hundreds of mating/unmating cycles, maintaining performance throughout its lifespan.
A: Yes. It supports mixed-signal applications, including power lines, digital signals, and high-frequency communication.
A: No. The side-in push/slide design enables quick, reliable assembly, compatible with both automated SMT production and manual maintenance.
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